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A mixed technology reliability

Selected Abstract

A mixed technology reliability assessment: using a mix of lead and Pb-free components, the authors found failure similar mechanisms for SAC and SnPb eutectic solder.
Availability of Pb-free components necessitated mixed technology, combining lead and Pb-free components. At Dade Behring, our intent was to provide early data that would reflect the impact on performance and reliability. This testing would help determine the need for critical changes and highlight ...
February 1, 2007; Circuits Assembly

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1. A mixed technology reliability assessment: using a mix of lead and Pb-free components, the authors found failure similar mechanisms for SAC and SnPb eutectic solder.